2.6 L SFF Case (PETG)
Tiny APU Case, Perfect for 8700G's and alike. This is about as small as I could get it without some crazy nonsensical design, using a readily available standard PSU, There are some smaller internal PSU's but usually hard to find or out of stock, This uses a regular FSP Flex so should be easier to obtain.
Body Print notes: Tree supports for bottom-buildplate, set overhang to 85-89% and avoid supports on hex air-holes (You print will be making overhang runs to avoid excessive support mat&PP)
Top Print notes: 0 Bottom 0 Top Layers, Add at least 4-8 walls for screw support. Infill will be your air pattern, Alternatively you can print it solid but thermals have not been tested in this config
V2.6 is - component specific to the following -
Gigabyte A620i AX (Or exact IO)
Noctua L9A AM5 (Or shorter)
FSP FLEX 300W (The one with the “step”) or very similar.
V2.6 UNI : IO Shield's add too much mm to board, and WILL require you too remove any IO shield from mobo. Uni's “Lid is 1mm thicker and NOT interchangable with V2.6”
Mini Itx Mobo. (Works with Asrock B650I), Unknown support for others
Noctua L9A AM5 (Or shorter)
FSP FLEX 300W (The one with the “step”) or very similar.
PART LIST:
14 M3 shorty heatset inserts (4x mobo/10xtop)
14 M3x6 screws
PSU's included screws.
12MM Power button
MOBO INSTALLATION:
You will be bending your case's IO area to fit the motherboard's Wifi dongles, by a lot I did not have to use heat, but depending on the PETG you use results may vary, I used RAPID PETG without issue.
Other: the corner mobo heatset inserts are tricky, You can insert then on the printbed before the top layers and you may need to adjust it after it's set and test fit with mobo from there. just add heat, move a little, fit again. For V2.6 “Psu top left screw may need a little sanding or heat adjustment”
The author marked this model as their own original creation.