Heated Enclosure

This project consists of building a nice heated chamber. The project was developed at the University of Luxembourg as a bachelor thesis. Sometimes an enclosure is not enough to print more technical materials. The heating allows to print at a stable temperature and humidity in the enclosure. The heating element is controlled via an arduino board.
This parts are needed:

The above mentioned parts need to be purchased, the case for the electronics and the fan cover need to be printed. The fan cover needs to be printed with a material that has good thermal stability (>100°C).
I tried with PLA, PETG and ABS. Abs was the only suitable material. The electronic case could be printed in PLA, when the Mosfet is cooled with a small fan.

Print instructions

• The electronic case can be printed with PLA. I recommend supports, they help to ensure that the connectors fit without problems.

• The fan cover must be printed with a material that is suitable
  for >100°C. The fan cover is designed to be printed without any supports.